GENERAL DESCRIPTION:

BONDMASTER E01 is a two-part adhesive typically used for small component bonding and will bond a wide variety of materials; i.e., wood, plastic and ceramic. This product fully cures at room temperature.Handling time is 5 minutes at 25ºC and cure is complete in 24 hours. Handling time is the time after part assembly when the parts will not move when subjected to moderate finger pressure. Should the cure rate requirement be increased, an external heat source may be introduced to facilitate cure. BONDMASTER E01 will cure in 30 minutes when heated to 60°C.

Features